![]() ![]() In recent years, we demonstrated successful integrations of LCI into several different laser material processing methods. Low coherence interferometry (LCI) is a high-precision measuring principle well-known from surface metrology. In order to enable narrow tolerance windows, a closedloop monitoring of the geometrical properties of the processed work piece is essential for achieving a robust manufacturing process. ![]() With the availability of high power pico- and femtosecond laser sources, laser material processing is advancing into applications, which demand for highest accuracies such as laser micro milling or laser drilling. Laser material processing has become an indispensable tool in modern production. It contains: 2.8.1 Introduction 2.8.2 Basics of process monitoring and closed-loop control 2.8.2.1 General 2.8.2.2 Process-surveillance objectives and strategies 2.8.2.2.1 Support for scientific research by monitoring of process output parameters 2.8.2.2.2 On-line treatment fault probability assessment and documentation during serial production 2.8.2.2.3 Closed-loop control during serial production 2.8.2.3 Treatment quality indicators, span of surveillance 2.8.2.4 Process output parameter detection 2.8.2.4.1 Theoretical introduction 2.8.2.4.2 Radiation emission from the interaction zone 2.8.2.4.3 Radiation reflection and transmission at the interaction zone 2.8.2.4.4 Radiation detection and sensor arrangement 2.8.2.4.5 Two-dimensionally resolved radiation emission 2.8.2.4.6 Sound detection 2.8.2.4.7 Electrical-charge detection 2.8.2.4.8 Multiple-sensor fusion 2.8.2.5 Signal assessment methods 2.8.2.6 Control actions 2.8.3 State of the art of process monitoring and control technology 2.8.3.1 Cutting and drilling 2.8.3.1.1 General 2.8.3.1.2 Scientific research 2.8.3.1.2.1 Cutting 2.8.3.1.2.2 Drilling, piercing 2.8.3.1.3 Industrial applications 2.8.3.2 Welding 2.8.3.2.1 General and historical 2.8.3.2.2 Recent scientific research 2.8.3.2.2.1 Optical emissions, photo-diode detection 2.8.3.2.2.2 Optical emissions, camera detection 2.8.3.2.2.3 Reflected laser radiation 2.8.3.2.2.4 Electrical charge collection 2.8.3.2.2.5 Multiple sensor schemes 2.8.3.2.2.6 X-ray and visible-light shadowgraphy, holography, laser beam probe, ultrasonic inspection 2.8.3.2.3 Industrial applications 2.8.3.2.3.1 Monitoring systems 2.8.3.2.3.2 Closed-loop control systems 2.8.3.3 Transformation hardening 2.8.3.4 Cladding, alloying 2.8.3.5 Cleaning, caving 2.8.4 Outlook This document is part of Subvolume C 'Laser Applications' of Volume 1 'Laser Physics and Applications' of Landolt-Börnstein - Group VIII Advanced Materials and Technologies.
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